Substrate processing method, substrate processing apparatus and substrate carrying method

ABSTRACT

The present invention is a method of performing processing for a substrate including the step of carrying the substrate, which has been pretreated, to a heat treatment unit for heating the substrate, prior to supplying a treatment solution to the substrate to perform solution treatment, in which the carrying is performed such as to fix a period after the pretreatment for the substrate is completed and before it is carried to the heat treatment unit. According to the present invention, for example, in a lithography process, the substrate is carried such as to fix the period after exposure processing that is the pretreatment and before the substrate is carried to the heat treatment unit where heat treatment that is the following treatment is performed, whereby the degrees of chemical reaction of coating films by the exposure processing become uniform between the substrates.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a substrate processing method, asubstrate processing apparatus and a substrate carrying method.

[0003] 2. Description of the Related Art

[0004] In a photolithography process in fabrication processes for thesemiconductor device, for example, resist coating treatment for forminga resist film on a wafer surface, exposure processing in which a patternis irradiated on the wafer and exposed, post-exposure baking treatmentfor heating the wafer after the exposure processing, developingtreatment for performing development for the heat-treated wafer and thelike are performed in sequence. These processing and treatments aresequentially performed in processing and treatment units separatelyprovided in a single coating and developing treatment system and analigner adjacent to the system. The coating and developing treatmentsystem is structured to process a plurality of wafers concurrently atthe same time, in which normally one carrier carries the wafers betweenthe above-mentioned processing and treatment units.

[0005] The carrier is configured to freely access the plurality ofprocessing and treatment units and its operation is controlled to carrythe wafers in the processing and treatment units at preferable timing inaccordance with the processing steps to the processing and treatmentunits in which the respective following steps are performed, so that aseries of the photolithography processing steps is smoothly performed.

[0006] However, one carrier carries a number of wafers as describedabove, and thus in the case where, for example, when the carrier iscarrying one wafer in one processing or treatment unit, treatment foranother wafer is completed in another processing or treatment unit, thecarrier can not carry the other wafer before it finishes carrying theone wafer. Meanwhile, when the carrier is not carrying a wafer but in awaiting state, the carrier can immediately carry the other wafer.Accordingly, the period required after the treatment for a waferfinishes and before the carrier goes to receive the wafer depends on theposition and the state of the carrier, presenting a fear that the totalperiods required from the end of one treatment to the start of thefollowing treatment become nonuniform between the wafers.

[0007] When a so-called chemically amplified resist is used as a resistsolution for forming the aforementioned resist film, exposure generatesacid, and the resist film reacts with the acid and the resist film inthe exposed portion changes to be soluble in the developing solution.Therefore, the degree of the developing treatment, that is, the linewidth of the circuit pattern on the wafer, greatly depends on progressof the chemical reaction by the acid, and the chemical reaction isgreatly affected by the period from the exposure to the development.

[0008] Accordingly, the period after the wafer is subjected to theexposure processing and before the developing treatment, especially, theperiod required from the exposure processing to the post-exposure bakingtreatment is affected by the position and the state of the carrier to benonuniform, presenting a fear of adversely affecting the line of thecircuit pattern which is finally formed on the wafer.

[0009] Further, the aforementioned carrying of the wafer is conducted asfollows, normally a main controller for controlling the carrier receivesa processing end signal from each processing or treatment unit andstores it, the carrier recognizes the stored processing end signal everycompletion of the carrying of one wafer, and the carrier verifies it andthen moves to the processing or treatment unit that is the sender tocarry the wafer for which predetermined processing has been completed inthe processing or treatment unit to the processing or treatment unitwhere the following step is performed.

[0010] According to the above-described control mechanism for thecarrier, however, since the carrier finishes the carrying of the presentwafer and verifies processing end signal in the main controller, andthen moves to the processing or treatment unit that is the sender, theperiod after the processing or treatment for the wafer finishes in theprocessing or treatment unit and before the carrier goes to theprocessing or treatment unit to receive the wafer differs depending onthe state of the carrier at the moment or the number of the processingend signals, and generally tends to be longer. Therefore, it isimpossible to carry the wafer between the processing and treatment unitsspeedily and in a fixed period.

[0011] Especially when the chemically amplified resist solution is usedas described above, a treatment is performed in which the acid, as acatalyst, generated in the resist film by the exposure is increased intemperature to activate, promoting the chemical reaction for making theresist film soluble in the developing solution in the post-exposurebaking treatment. In the following cooling treatment, a treatment ofdecreasing the acid in temperature to stop the catalysis of the acid isperformed. Therefore, unless the wafer is speedily carried between thepost-exposure baking unit and the cooling treatment unit, the wafer isoverbaked to cause the chemical reaction to excessively proceed by thecatalysis of the acid to widen the width of the resist film soluble inthe developing solution, resulting in too wide line width of the circuitpattern which is finally formed on the wafer. Furthermore, if the waferis not carried between the post-exposure baking unit and the coolingtreatment unit in a fixed manner, there is a fear that line widths ofthe circuit patterns formed on wafers will become nonuniform between thewafers.

SUMMARY OF THE INVENTION

[0012] The present invention is made in view of the above-describedpoints, and its object is to fix the period required, for example, fromexposure processing to post-exposure baking treatment, that is, to heattreatment before developing treatment in a photolithography process, orto make an improvement to make the period close to fixed.

[0013] Further, a second object of the present invention is to shortenthe period after the completion of heat treatment and before thesubstrate is cooled and to fix the period.

[0014] The present invention is a method of performing processing for asubstrate including the step of carrying the substrate, which has beenpretreated, to a heat treatment unit for heating the substrate, prior tosupplying a treatment solution to the substrate to perform solutiontreatment, wherein the carrying is performed such as to fix a periodafter the pretreatment for the substrate is completed and before thesubstrate is carried to the heat treatment unit.

[0015] According to another aspect, the present invention is a method ofperforming processing for a substrate including the step of carrying thesubstrate, which has been exposure-processed, to a heat treatment unitwhere heat treatment before developing treatment is performed, whereinthe carrying is performed such as to fix a period after the exposureprocessing for the substrate is completed and before the substrate iscarried to the heat treatment unit.

[0016] According to still another aspect, the present invention is amethod of performing processing for a substrate including the steps ofcarrying the substrate, which has been exposure-processed, temporarilyto a delivery unit by a first carrier, and thereafter carrying thesubstrate staying in the delivery unit to a heat treatment unit whereheat treatment before developing treatment is performed, by a secondcarrier, wherein at least when the exposure for the substrate iscompleted, the first carrier is waiting at a first position where thefirst carrier is capable of receiving the exposed substrate toimmediately carry the substrate, for which the exposure has beencompleted, to the delivery unit, and wherein at least when the exposedsubstrate is carried to the delivery unit, the second carrier is waitingat a second position where the second carrier is capable of receivingthe substrate staying in the delivery unit to carry the substrate to theheat treatment unit immediately after the exposed substrate is carriedto the delivery unit.

[0017] According to yet another aspect, the present invention is amethod of performing processing for a substrate including the steps ofcarrying the substrate, which has been exposure-processed, temporarilyto a delivery unit by a first carrier, and thereafter carrying thesubstrate staying in the delivery unit to a heat treatment unit whereheat treatment before developing treatment is performed, by a secondcarrier, wherein at least when the exposure processing for the substrateis completed, the first carrier is waiting at a predetermined positionwhere the first carrier is capable of receiving the substrate to carrythe substrate to the delivery unit immediately after the exposureprocessing for the substrate is completed.

[0018] According to further another aspect, the present invention is amethod of performing processing for a substrate including the steps ofcarrying the substrate, which has been exposure-processed, temporarilyto a delivery unit by a first carrier, and thereafter carrying thesubstrate staying in the delivery unit to a heat treatment unit whereheat treatment before developing treatment is performed, by a secondcarrier, wherein at least when the substrate is carried to the deliveryunit, the second carrier is waiting at a predetermined position wherethe second carrier is capable of receiving the substrate to carry thesubstrate to the heat treatment unit immediately after the substrate iscarried to the delivery unit.

[0019] The apparatus of the present invention is a substrate processingapparatus for performing processing for a substrate including a carrierfor carrying the substrate, which has been pre-treated, to a heattreatment unit for heating the substrate prior to solution treatmentperformed by supplying a treatment solution to the substrate, and acontroller for controlling the carrier such as to fix a period after thepretreatment for the substrate is completed and before the substrate iscarried to the heat treatment unit.

[0020] According to another aspect, the present invention is a substrateprocessing apparatus for performing processing for a substrate includinga carrier for carrying the substrate, which has been exposure-processed,to a heat treatment unit where heat treatment before developingtreatment is performed, and a controller for controlling the carriersuch as to fix a period after the exposure processing for the substrateis completed and before the substrate is carried to the heat treatmentunit.

[0021] According to still another aspect, the present invention is asubstrate processing apparatus for performing processing for a substrateincluding a first carrier for carrying the substrate, which has beenexposure-processed, to a delivery unit, a second carrier for carryingthe substrate staying in the delivery unit to a heat treatment unitwhere heat treatment before developing treatment is performed, and acontroller for controlling the first carrier and the second carrier,wherein the controller conducts a control so that at least when theexposure processing for the substrate is completed, the first carrier iswaiting at a first position where the first carrier is capable ofreceiving the exposed substrate to immediately carry the substrate, forwhich the exposure processing has been completed, to the delivery unit,and further at least when the exposure-processed substrate is carried tothe delivery unit, the second carrier is waiting at a second positionwhere the second carrier is capable of receiving the substrate stayingin the delivery unit to carry the substrate to the heat treatment unitimmediately after the exposure-processed substrate is carried to thedelivery unit.

[0022] According to yet another aspect, the present invention is asubstrate processing apparatus for performing processing for a substrateincluding a first carrier for carrying the substrate, which has beenexposure-processed, to a delivery unit, a second carrier for carryingthe substrate staying in the delivery unit to a heat treatment unitwhere heat treatment before developing treatment is performed, and acontroller for controlling the first carrier and the second carrier,wherein the controller conducts a control so that at least when theexposure processing for the substrate is completed, the first carrier iswaiting at a predetermined position where the first carrier is capableof receiving the substrate to carry the substrate to the delivery unitimmediately after the exposure processing for the substrate iscompleted.

[0023] According to further another aspect, the present invention is asubstrate processing apparatus for performing processing for a substrateincluding a first carrier for carrying the substrate, which has beenexposure-processed, to a delivery unit, a second carrier for carryingthe substrate staying in the delivery unit to a heat treatment unitwhere heat treatment before developing treatment is performed, and acontroller for controlling the first carrier and the second carrier,wherein the controller conducts a control so that at least when thesubstrate is carried to the delivery unit, the second carrier is waitingat a predetermined position where the second carrier is capable ofreceiving the substrate to carry the substrate to the heat treatmentunit immediately after the substrate is carried to the delivery unit.

[0024] Furthermore, in order to attain the second object, according tothe present invention, in a substrate carrying method of carrying asubstrate, which has been heat-treated in a heat treatment unit, by acarrier to a cooling treatment unit where cooling treatment for thesubstrate is performed, at least when the heat treatment for thesubstrate is completed, the carrier is waiting at a predeterminedposition where the carrier is capable of receiving the substrate in theheat treatment unit.

[0025] The present invention includes the step of carrying thesubstrate, which has been pre-treated, to a heat treatment unit forheating the substrate, prior to supplying a treatment solution to thesubstrate to perform solution treatment, wherein the carrying isperformed such as to fix a period after the pretreatment for thesubstrate is completed and before the substrate is carried to the heattreatment unit.

[0026] According to the present invention, since the carrying of thesubstrate is performed such as to fix the period after the pretreatmentfor the substrate is completed and before it is carried to the heattreatment unit, for example, the substrate is carried such as to fix theperiod after the exposure processing that is the pretreatment and beforeit is carried to the heat treatment unit where heat treatment that isthe following treatment, whereby the degrees of the chemical reaction ofthe coating films by the above-described exposure processing becomeuniform between substrates. Thus, the developing treatment is performedfor the substrates at the same degree, uniformly forming the line widthsof the circuit patterns which are finally formed on the substratesbetween substrates.

[0027] For example, the carrying such as to fix the period after thecompletion of the exposure processing for the substrate and before it iscarried to the heat treatment unit is realized, for example, bycontrolling the operation of the carrier for carrying the substrate fromthe aligner to the heat treatment unit. More specifically, it issuggested that, for example, the carrier is kept waiting in front of thealigner in advance to carry the substrate to the heat treatment unitimmediately after the exposure is completed and the substrate comes outof the aligner, the carrying of the substrate is always started after alapse of a fixed period from the completion of the exposure processing,the carrier holding the substrate is suspended at a predetermined placeand the suspension period in the event is adjusted, or the like.

[0028] Furthermore, according to the present invention, when theexposure processing for the substrate is completed, the first carrier iswaiting at the first position where it can receive the substrate tocarry the substrate to the delivery unit immediately after thecompletion of exposure for the substrate. Furthermore, when thesubstrate is carried to the delivery unit, the second carrier is waitingat the second position where it can receive the substrate to carry thesubstrate to the heat treatment unit immediately after the substrate iscarried to the delivery unit. The first and second carriers wait at therespective predetermined positions preceding to the carrying of othersubstrates, eliminating the fact that the carriers are, for example,carrying the other substrates or have moved to the positions where theycan not immediately receive the substrate, with the result that thecarrying period for the substrate from the exposure processing to theheat treatment unit is kept fixed. Accordingly, the above-describedchemical reaction of the solubilization in the developing solutionuniformly proceeds, whereby the developing treatment is uniformlyperformed for the substrates, reducing nonuniformity in line width ofthe finally formed pattern between the substrates. It should be notedthat the first carrier and the second carrier are preferably waiting atthe respective predetermined positions at least when the exposure iscompleted and at least when the substrate is carried to the deliveryunit respectively, and they may be previously waiting from apredetermined period before.

[0029] According to the present invention, the carrier is kept waitingfrom before the completion of the heat treatment at the predeterminedposition where it can receive the substrate in the heat treatment unitto receive the substrate immediately after the completion of the heattreatment and carry it to the cooling treatment unit. This shortens theperiod after the completion of the heat treatment and before thesubstrate is subjected to the cooling treatment and keeps the periodfixed. Therefore, overbaking in the heat treatment and nonuniformity inpattern which is finally formed on the substrate between substrates arereduced.

[0030] The heat treatment unit gives notice of completion of the heattreatment to the carrier controller, and the carrier controller movesthe carrier to the waiting position based on the notice, whereby thecarrier can recognize at an earlier time that the heat treatment isimmediately before completion, and move to the predetermined positionbefore the completion of the heat treatment and wait there. Therefore,when the heat treatment is completed, the carrier can be waiting at theposition where it can access the heat treatment unit and immediatelycarry the substrate, for which the heating has been completed, to thecooling treatment unit.

[0031] By giving discrimination marks to the substrates, when thecarrier can not be waiting at the predetermined position at thecompletion of the heat treatment of the substrate, for example, when thecarrier can not be waiting by the completion of the heat treatmentbecause the carrier delays in moving to the predetermined positionbecause of the carrying of another substrate, the substrate, which ispresumed to be subjected to the heat treatment at the moment and madestand in a state of a high temperature for a period longer than theother substrates, can be recognized as a substrate needing caution basedon its discrimination mark. This makes it possible to recognize thesubstrate of high possibility of being overbaked and remove thesubstrate needing caution from the other substrates when necessary. Notethat the discrimination mark given to the substrate is not limited toone actually provided on the substrate, but it may be an imaginarydiscrimination mark, for example, a code which is recognized by acontroller or the like to result in discrimination of each substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

[0032]FIG. 1 is a perspective view showing the appearance of a coatingand developing treatment system in which a coating and developingtreatment method according to this embodiment is carried out;

[0033]FIG. 2 is a plane view roughly showing the coating and developingtreatment system in FIG. 1;

[0034]FIG. 3 is an explanatory view showing an arrangement example ofprocessing and treatment units in processing unit groups of the coatingand developing treatment system;

[0035]FIG. 4 is a state view of the coating and developing treatmentsystem showing a state in which a main carrier unit and a carrier arewaiting;

[0036]FIG. 5 is an explanatory view showing the relation betweenexposure processing period and maximum waiting period;

[0037]FIG. 6 shows a flowchart of wafer processing in relation to atimer function of the main carrier unit;

[0038]FIG. 7 is a perspective view showing the appearance of a coatingand developing treatment system in which a method of carrying the waferaccording to a second embodiment of the present invention is carriedout;

[0039]FIG. 8 is a plane view roughly showing the coating and developingtreatment system in FIG. 7;

[0040]FIG. 9 is an explanatory view showing an arrangement example ofprocessing and treatment units in processing unit groups of the coatingand developing treatment system;

[0041]FIG. 10 is an explanatory view schematically showing theconfiguration of a control mechanism for controlling a main carrierunit;

[0042]FIG. 11 shows a flowchart of wafer processing in relation to themain carrier unit;

[0043]FIG. 12 is a state view of the coating and developing treatmentsystem showing a state in which the main carrier unit is waiting at apredetermined position; and

[0044]FIG. 13 is a plane view roughly showing the coating and developingtreatment system when a cassette for needing caution in a cassettestation.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0045] Hereinafter, preferred embodiments of the present invention aredescribed. FIG. 1 is a perspective view of a coating and developingtreatment system 1 as a coating and developing treatment apparatus inwhich a coating and developing treatment method of the present inventionis carried out, and FIG. 2 is a plane view roughly showing the coatingand developing treatment system.

[0046] As shown in FIG. 1 and FIG. 2, the coating and developingtreatment system 1 has a configuration in which a cassette station 2 forcarrying, for example, a plurality of wafers W in a cassette, as a unit,from/to the outside into/out of the coating and developing treatmentsystem 1 and carrying the wafer W into/out of a cassette C, a processingstation 3 in which various kinds of processing and treatment units eachfor performing predetermined processing or treatment for the wafers Wone by one in coating and developing treatment steps are arranged sideby side in two rows in a Y-direction, and an interface section 6 whichis provided adjacent to the processing station 3 and includes a carrier5 as a first carrier unit for carrying the wafer W between theprocessing station 3 and an aligner 4 provided outside the coating anddeveloping treatment system 1, are integrally connected.

[0047] In the cassette station 2, a plurality of cassettes C can bemounted in a line in an X-direction. A wafer carrier 8 transportable inthe direction of arrangement of the cassettes (the X-direction) and inthe direction of arrangement of the wafers W housed in the cassette C (aZ-direction; a vertical direction) is provided to freely move along acarrier guide 9 to be able to selectively access each cassette C.

[0048] In the processing station 3, a carrier rail 10 extending in theY-direction is provided at the center, and a main carrier unit 11 isprovided as a second carrier unit movable on the carrier rail 10. Acrossthe carrier rail 10, various kinds of processing and treatment units arearranged on both sides in the Y-direction. More specifically, a brushscrubber 12 for cleaning the wafer W taken out of the cassette C, a wetcleaner 13 for performing high pressure jet cleaning for the wafer W,and treatment unit groups 14, 15 and 16 in each of which a plurality ofthermal treatment units each for performing predetermined thermaltreatment for the wafer W are multi-tiered, are arranged side by side,in order from the cassette station 2 side, on the front side of thecarrier rail 10 in the X-direction. Meanwhile, resist coating units 17and 18 each for applying a resist solution to the wafer W and developingtreatment units 19 and 20 each for performing developing treatment forthe exposure-processed wafer W are arranged side by side, in order fromthe cassette station 2 side, on the rear side of the carrier rail 10 inthe X-direction.

[0049] In the processing unit group 14, as shown in FIG. 3, for example,a cooling unit 21 for performing cooling treatment for the wafer W, anadhesion unit 22 for enhancing adhesion of the resist solution to thewafer W, pre-baking units 23 and 24 each for evaporating a solvent inthe resist solution are tiered in order from the bottom. In theprocessing unit group 15, cooling units 26 and 27 and post-baking units28 and 29 each for performing heat treatment for the developing-treatedwafer W tiered in order from the bottom.

[0050] In the processing unit group 16, cooling units 30 and 31 andpost-exposure baking units (hereinafter, referred to as “PEB units”) 32and 33 as heat treatment units each for performing heat treatment forthe wafer W after exposure processing and before developing treatment,are tiered in order from the bottom.

[0051] The main carrier unit 11 is configured to be movable in adirection of rotation (a θ-direction) and in the Z-direction, as shownin FIG. 1 and FIG. 2, in addition to the above-described Y-direction soas to access and carry the wafer W to the processing and treatment unitsin the processing station 3, the wafer carrier 8 in the cassette station2, and extension units 35 and 36 as delivery units in the interfacesection 6.

[0052] The main carrier unit 11 is controlled by a main controller 37having a carrying algorithm as a program. More specifically, the maincarrier unit 11 is controlled to carry in sequence each wafer W underprocessing in the processing station 3 to a processing unit where thefollowing processing is performed in accordance with a predeterminedprocessing flow for the wafer W The main controller 37 controls the maincarrier unit 11 so that when the wafer W for which at least exposureprocessing has been finished is carried to the above-described extensionunit 36, the main carrier unit 11 is waiting at a waiting position P, asshown in FIG. 4, as a second position where the main carrier unit 11 canaccess the extension unit 36, that is a position where the main carrierunit 11 approaches closest to the extension unit 36 on the carrier rail10.

[0053] The main controller 37 is provided with a timer function forcounting a maximum waiting period M, which is a maximum period duringwhich the main carrier unit 11 is waiting at the waiting position P.This timer function is for releasing the waiting by the main carrierunit 11 when some trouble occurs in the aligner 4 and thus the wafer Wis not sent out of the aligner 4.

[0054] The timer function is configured to start counting when the waferW is carried into the aligner 4 and stop the counting when the wafer Wis carried out of the aligner 4. Accordingly, the main carrier unit 11is configured to be usually waiting at the waiting position P until itreceives at the extension unit 36 the wafer W from the aligner 4, but ifthe wafer W is not sent out of the aligner 4 by the time when themaximum waiting period M which the timer function counts elapses, thewaiting by the main carrier unit 11 is released.

[0055] As shown in FIG. 5, when it is assumed that a period usuallyrequired for an exposure processing step after the wafer W is carriedinto the aligner 4 until it is carried out of the aligner 4 is anexposure processing period T as a predetermined period T, the maximumwaiting period M is previously set to be, for example, M=2T, which issufficiently longer than the exposure processing period T.

[0056] As shown in FIG. 1 and FIG. 2, the extension units 35 and 36 eachfor delivering the wafer W between the main carrier unit 11 and thecarrier 5 are arranged tiered in order from the bottom on the processingstation 3 side of the interface section 6 and on the extension line ofthe carrier rail 10. Each of the extension units 35 and 36 includes amounting table (not shown) for mounting the wafer W thereon and raisingand lowering pins (not shown) for raising and lowering the wafer W. Theextension unit 35 is used when the wafer W is carried from the maincarrier unit 11 to the carrier 5 side, and the extension unit 36 is usedwhen the wafer W is carried from the carrier 5 to the main carrier unit11 side. On the aligner 4 side of the interface section 6, a carrying-inmounting table 38 on which the wafer W is temporarily mounted when thewafer W is carried into the aligner 4, and a carrying-out mounting table39 on which the wafer W is mounted when the wafer W is carried out ofthe aligner 4, are arranged side by side in the X-direction.

[0057] At the center of the interface section 6, a rail 6 a extending inthe X-direction is provided, on which the above-described carrier 5 isprovided to freely move. The carrier 5 is configured to freely move inthe X-direction, the Z-direction, and freely rotate in the θ-direction(a direction of rotation around the Z-axis) so as to access theextension units 35 and 36, the carrying-in mounting table 38 and thecarrying-out mounting table 39 and carry the wafer W to them. Thecarrier 5 is controlled by the main controller 37 similarly to the maincarrier unit 11 so that at least when the wafer W, for which exposureprocessing has been completed, is mounted on the carrying-out mountingtable 39, the carrier 5 is waiting at a waiting position Q, as shown inFIG. 4, as a first position where the carrier 5 can receive the wafer Won the carrying-out mounting table 39.

[0058] The timer function of the main controller 37 is used also for thecarrier 5, so that the carrier 5 is configured to wait at the waitingposition Q until a period not longer than a maximum waiting period Ielapses, but if the wafer W is not sent out of the aligner 4 by the timethe maximum waiting period I elapses, the waiting by the carrier 5 isreleased. The main controller 37 also controls the carrier 5 as acarrier unit.

[0059] In this embodiment, the maximum waiting period I of the carrier 5is set at the same value as the maximum waiting period M of the maincarrier unit 11 as shown in FIG. 5. Sometimes the exposure processing isnot performed in the period as usual because of alignment operation orthe like in the aligner 4, and thus the maximum waiting period I ispreferably set at the longest period possible keeping in a considerationnonuniformity in period of the exposure processing step.

[0060] The aligner 4 is provided adjacent to the interface section 5 asshown in FIG. 1. The aligner 4 is provided with a carrier opening 40through which the wafer W passes when carried into/out of the aligner 4.In the aligner 4, a carrier means not shown is provided to carry in thewafer W from the aforesaid carrying-in mounting table 38 and carry outthe wafer W to the aforesaid carrying-out mounting table 39. The carrieropening 40 is provided with a sensor 41 for detecting the wafer W beingcarried into/out of the aligner 4 and sending the signal to the maincontroller 37, so that with the signal as a trigger the counting of thetimer function in the main controller 37 is started or stopped.

[0061] Next, the coating and developing treatment method which iscarried out in the coating and developing treatment system 1 structuredas described above is explained along the process of thephotolithography processing steps.

[0062] Initially, in the cassette station 2, the wafer carrier 8 takesone unprocessed wafer W out of the cassette C, and then the main carrierunit 11 receives the wafer W direct from the wafer carrier 8.Subsequently, the main carrier unit 11 carries the wafer W in sequenceto the brush scrubber 12 and the wet cleaner 13, where the wafer W issubjected to predetermined cleaning treatment.

[0063] Thereafter, the wafer W is carried again by the main carrier unit11 to the adhesion unit 22 included in the processing unit group 14 andcoated with an adhesion promoter such as HMDS for enhancing adhesion tothe resist solution. Then, the wafer W is carried in sequence by themain carrier unit 11 to the cooling unit 21, the resist coating unit 17or 18, the pre-baking unit 23 or 24, and the cooling unit 26 or 27 to besubjected to predetermined processing.

[0064] The wafer W which has been cooled to a predetermined temperaturein the cooling unit 26 or 27 is carried by the main carrier unit 11 intothe extension unit 35 and mounted on a mounting table not shown.

[0065] Then, the wafer W is carried by the carrier 5 to the carrying-inmounting table 38 near the aligner 4, while the main carrier unit 11carries other wafers in the treatment units in the processing station 3to the treatment units where the respective next steps are performedwhile moving on the carrier rail 10 in accordance with the carryingprogram of the main controller 37 during a predetermined period E. Thepredetermined period E here is a period during which the main carrierunit 11 may carry the other wafers, that is, a predetermined set periodshorter than a period which is usually required after the wafer W ismounted on the extension unit 35 and before the wafer W is sent out ofthe aligner 4 as shown in FIG. 5.

[0066] After the predetermined period E elapses, the main carrier unit11 moves to the waiting position P where it is accessible to theextension unit 36, and waits there until the wafer W which has beencarried into the aligner 4 is returned to the extension unit 36. Itshould be noted that the predetermined period E is set, for example, tobe the same period as the exposure processing period T so that the maincarrier unit 11 is waiting without fail at the waiting position P whenthe wafer W for which exposure processing is finished and mounted on theextension unit 36.

[0067] The wafer W mounted on the carrying-in mounting table 38 by thecarrier 5 is carried through the carrier opening 40 of the aligner 4into the aligner 4 by the carrier means not shown in the aligner 4.Hereinafter, the processing for the wafer W relating to the timerfunction is shown in the flowchart in FIG. 6. In this event, the sensor41 at the carrier opening 40 detects the carrying-in of the wafer W, andsends the signal to the main controller 37. In the main controller 37which has received the signal, the counting by the aforesaid timerfunction is started taking the signal as a trigger. The carrier 5 movesto the waiting position Q where it is accessible to the carrying-outmounting table 39, and waits there until exposure processing for thewafer W is completed.

[0068] Thereafter, a predetermined pattern is exposed on the wafer W inthe aligner 4. While this exposure processing is performed, theaforesaid predetermined period E of the main carrier unit 11 elapses,and the main carrier unit 11 thus moves to the waiting position P andwaits there (becomes the state in FIG. 4). Normally, after a lapse ofthe aforesaid exposure processing period T, the wafer W is sent out fromthe carrier opening 40 of the aligner 4 and mounted on the carrying-outmounting table 39. In this event, the sensor 41 detects the carrying-outof the wafer W, and sends the signal to the main controller 37, wherebythe counting by the timer function of the main controller 37 is stoppedand reset.

[0069] The wafer W mounted on the carrying-out mounting table 39 isimmediately delivered to the carrier 5 waiting at the waiting positionQ, and the carrier 5 carries the wafer W to the extension unit 36. Thewafer W carried to the extension unit 36 is immediately delivered to themain carrier unit 11 waiting at the waiting position P, and carried tothe PEB unit 32 or 33 by the main carrier unit 11.

[0070] When some trouble happens in the aligner 4 and the wafer W is notsent out of the aligner 4 even when the maximum waiting period I or Melapses, the timer function is stopped to release the waitinginstruction to the carrier 5 and the main carrier unit 11. Then, thecarrier 5 stops, for example, its operation, and the main carrier unit11 carries the other wafers W remaining in the processing station 3, forwhich exposure processing has been properly performed, along thepredetermined processing steps described below and stops its operationafter the wafers W are carried out of the processing station 3 to thecassette station 2.

[0071] The wafer W which has been properly exposed to light and carriedto the PEB unit 32 or 33 is subjected to heat treatment for promotingsolubilization reaction of the resist film in the developing solution.Then, the wafer W is immediately carried to the cooling unit 30 or 31 bythe main carrier unit 11 and cooled to a predetermined temperature.Subsequently, the wafer W is carried to the developing treatment unit 19or 20 and subjected to developing treatment.

[0072] The wafer W for which the developing treatment has been completedis delivered again to the main carrier unit 11, and carried backward inthe Y-direction on the carrier rail 10 by the main carrier unit 11 to bedelivered to the wafer carrier 8 in the cassette station 2. The wafer Wis returned to the cassette C by the wafer carrier 8, and a series ofphotolithography processing steps is thus completed.

[0073] According to the above-described embodiment, the carrier 5 andthe main carrier unit 11 are waiting at the predetermined waitingpositions Q and P respectively for the wafer W to come, quickly carryingthe wafer W from the exposure processing to the PEB treatment in a fixedperiod. This equalizes periods required from the exposure processing tothe PEB treatment between the wafers W, whereby the solubilizationreaction of the resist film to the developing solution uniformlyproceeds, and the developing treatment is uniformly performed, resultingin line widths formed on the wafers W uniform between the wafers W.

[0074] By providing the timer function in the main controller 37 to setthe maximum waiting periods I and M of the carrier 5 and the maincarrier unit 11, when the wafer W is not sent out of the exposureprocessing because of some reason, the carrying by the carrier 5 may bestopped for a check of the aligner 4, and the main carrier unit 11 maycarry the other wafers W remaining in the processing station 3, forwhich exposure has been properly performed, to allow them to besubjected to the end of processing.

[0075] In the above-described embodiment, both of the main carrier unit11 and the carrier 5 are configured to keep waiting, but it is alsopreferable that when there occurs no nonuniformity between the wafers Win period required before the carrier or carrier unit receives the waferW by virtue of the structure of the coating and developing treatmentsystem 1 and the carrying algorithm for the carrier or carrier unit, thecarrier or carrier unit without nonuniformity is not kept waiting butthe other carrier or carrier unit is kept waiting. More specifically, itis preferable to keep only the main carrier unit 11 or only the carrier5 waiting. Also in this case, it is preferable that the timer functionis naturally provided ready for the case in which the exposureprocessing is not performed in the predetermined period.

[0076] The embodiment explained hereinbefore is for the coating anddeveloping treatment method for the wafer W in the photolithographyprocess in the semiconductor wafer device fabrication processes, and thepresent invention is applicable to a coating and developing treatmentmethod for a substrate other than the semiconductor wafer, for example,an LCD substrate.

[0077] According to the present invention, it is possible to fix theperiod from the completion of the exposure processing for the substrateto the start of the heat treatment before the developing treatment,whereby chemical reaction by the exposure to the coating film proceedsto a fixed degree and thus the wafers W are subjected to the developingtreatment to a fixed degree, resulting in uniform line width which isfinally formed on the substrate between the substrates.

[0078] The carrier and carrier unit previously keep waiting to receivethe substrate and immediately carry it, thereby also reducing the periodrequired from the completion of the exposure processing to theperformance of the heat treatment before the developing treatment.

[0079] The maximum waiting periods of the carrier and carrier unit areprovided, thereby making it possible to cope also with the case in whichthe exposure processing is not properly performed.

[0080] Next, a second embodiment of the present invention is explained.FIG. 7 is a perspective view of a coating and developing treatmentsystem 101 in which a method of carrying the substrate of the presentinvention is carried out, and FIG. 8 is a plane view roughly showing thecoating and developing treatment system.

[0081] As shown in FIG. 7 and FIG. 8, the coating and developingtreatment system 101 has a configuration in which a cassette station 102for carrying, for example, a plurality of wafers W in a cassette, as aunit, from/to the outside into/out of the coating and developingtreatment system 101 and carrying the wafer W into/out of a cassette C,a processing station 103 in which various kinds of processing andtreatment units each for performing predetermined processing ortreatment for the wafers W one by one in coating and developingtreatment steps are arranged side by side in two rows in a Y-direction,and an interface section 104 for delivering the wafer W to/from analigner not shown which is provided adjacent to the processing station103, are integrally connected.

[0082] In the cassette station 102, a plurality of cassettes C can bemounted in a line in an X-direction. A wafer carrier 108 transportablein the direction of arrangement of the cassettes (the X-direction) andin the direction of arrangement of the wafers W housed in the cassette C(a Z-direction; a vertical direction) is provided to freely move along acarrier guide 109 to be able to selectively access each cassette C.

[0083] In the processing station 103, a carrier rail 110 extending inthe Y-direction is provided at the center, on which a main carrier unit111 is provided as a carrier unit freely moving on the carrier rail 110.Across the carrier rail 110, various kinds of processing and treatmentunits are arranged side by side on both sides in the Y-direction. Morespecifically, a brush scrubber 112 for cleaning the wafer W taken out ofthe cassette C, a wet cleaner 113 for performing high pressure jetcleaning for the wafer W, and treatment unit groups 114, 115 and 116 ineach of which a plurality of thermal treatment units each for performingpredetermined thermal treatment for the wafer W are multi-tiered, arearranged side by side, in order from the cassette station 102 side, onthe front side of the carrier rail 110 in the X-direction. Meanwhile,resist coating units 117 and 118 each for applying a resist solution tothe wafer W and developing treatment units 119 and 120 each forperforming developing treatment for the exposure-processed wafer W arearranged side by side, in order from the cassette station 102 side, onthe rear side of the carrier rail 110 in the X-direction.

[0084] The main carrier unit 111 is configured to freely move in adirection of rotation (a θ-direction) and in the Z-direction, as shownin FIG. 7 and FIG. 8, in addition to the above-described Y-direction soas to access the processing and treatment units in the processingstation 103, the wafer carrier 108 in the cassette station 102, andextension units 135 and 136 as delivery units in the interface section104 described below to carry the wafer W to them.

[0085] The main carrier unit 111 is configured to be controllable by amain controller 121 as a carrier controller as shown in FIG. 8, so thatthe main carrier unit 111 is controlled by the main controller 121 tocarry the wafer W in accordance with a processing flow for the wafer W.

[0086] In the processing unit group 114, as shown in FIG. 9, forexample, a cooling unit 122 for performing cooling treatment for thewafer W, an adhesion unit 123 for enhancing adhesion of the resistsolution to the wafer W, pre-baking units 124 and 125 each forevaporating a solvent in the resist solution are tiered in order fromthe bottom. In the processing unit group 115, cooling units 126 and 127and post-baking units 128 and 129 each for performing heat treatment forthe developing-treated wafer W tiered in order from the bottom.

[0087] In the processing unit group 116, cooling units 130 and 131 andpost-exposure baking units (hereinafter, referred to as “PEB units”) 132and 133 as heat treatment units each for performing heat treatment forthe wafer W after exposure processing and before developing treatment,are tiered in order from the bottom. Casings of the PEB units 132 and133 are provided with carrier openings 132 a and 133 a facing thecarrier rail 110, as shown in FIG. 7, through which the wafer W iscarried in/out. These carrier openings 132 a and 133 a are respectivelyprovided with shutters 132 b and 133 b for preventing heat in the PEBunits 132 and 133 from diffusing and adapted to open only when the waferW is carried in/out.

[0088] In the PEB units 132 and 133 are provided with controllers 132 cand 133 c for controlling the operation of the PEB units 132 and 133 inthe PEB treatment for the wafer W as shown in FIG. 10. Each of thecontrollers 132 c and 133 c is configured to be able to send a dummy endsignal as an end notice signal for giving the main controller 121 noticeof a predetermined period T before the completion of the PEB treatment.Note that the predetermined period T is previously set in thecontrollers 132 c and 133 c and may be changed.

[0089] The main controller 121 is configured to be able to receive thesignals from the above-described controllers 132 c and 133 c of the PEBunits 132 and 133 so as to receive the dummy end signals. The maincontroller 121 is configured to be able to send and receive the signalto/from the main carrier unit 111 to control it as described above, sothat a controlling instruction can be sent and their states can berecognized each other by sending and receiving the signal. The maincontroller 121 is provided with a storage function for storing receiveddata, in which the signal received by the main controller 121 can bestored when necessary.

[0090] The main controller 121 is configured to be able to send andreceive signals also to/from the processing and treatment units otherthan the PEB units 132 and 133 in the processing station 103 so as toreceive end signals of wafer processing sent from the processing andtreatment units and store them by the aforesaid storing function. Themain carrier unit 111 is configured to recognize and verify the waferprocessing end signal stored in the main controller 121 and then move tothe processing unit, the sender of the end signal, to carry the wafer Wto the processing unit where the following processing is performed.

[0091] In the interface section 104, as shown in FIG. 7 and FIG. 8, acarrier 140 for carrying the wafer W between the processing station 103and the aligner not shown is provided to freely move in the X-direction,the Z-direction, and in the θ-direction. The extension units 135 and 136each for delivering the wafer W between the main carrier unit 111 andthe carrier 140 are arranged tiered in order from the bottom on theprocessing station 103 side of the interface section 104 and on theextension line of the carrier rail 110. Each of the extension units 135and 136 includes a mounting table not shown for mounting the wafer Wthereon and raising and lowering pins not shown for raising and loweringthe wafer W. The extension unit 135 is used when the wafer W is carriedfrom the main carrier unit 111 to the carrier 140, and the extensionunit 136 is used when the wafer W is carried from the carrier 140 to themain carrier unit 111.

[0092] Next, the method of carrying the wafer W which is carried out inthe coating and developing treatment system 101 structured as describedabove is explained with the process of the photolithography processingsteps.

[0093] Initially, in the cassette station 102, the wafer carrier 108takes one unprocessed wafer W out of the cassette C, and then the maincarrier unit 111 receives the wafer W direct from the wafer carrier 108.Subsequently, the main carrier unit 111 carries the wafer W in sequenceto the brush scrubber 112 and the wet cleaner 113, and further insequence to the adhesion unit 123 and the cooling unit 122 which areincluded in the processing unit group 114, whereby the wafer W issubjected to predetermined processing in the processing and treatmentunits. Then the wafer W is carried by the main carrier unit 111 to theresist coating unit 117 or 118 to be coated thereon with a chemicallyamplified resist solution, whereby a resist film is formed on the waferW. The wafer W on which the resist film formed is then carried again bythe main carrier unit 111 in sequence to the pre-baking unit 124 or 125and the cooling unit 126 to be subjected to predetermined processingthere.

[0094] The wafer W which has been cooled to a predetermined temperaturein the cooling unit 126 or 127 is carried by the main carrier unit 111into the extension unit 135 of the interface section 104 and mounted onthe mounting table not shown. Subsequently, the wafer W is carried bythe carrier 140 to the aligner not shown, where a predetermined patternis exposed on the wafer W. In this event, acid, which acts as a catalystfor solubilization reaction of the resist film in the developingsolution, generates in the resist film in the exposed portion. The waferW for which exposure processing has been completed is carried again bythe main carrier 140 to the extension unit 136, and then carried by themain carrier unit 111 into the PEB unit 133 through the carrier opening133 a of the PEB unit 133.

[0095] The following wafer processing is explained along the flow chartin FIG. 11. The wafer W is initially heated at a predeterminetemperature in the PEB unit 133, whereby the acid in the resist film isactivated to proceed the solubilization reaction of the resist film inthe exposed part to the developing solution. Then, when it is apredetermined period T before the completion of the heat treatment, thecontroller 133 c sends a dummy end signal of giving notice that it isimmediately before the completion of the heat treatment, to the maincontroller 121.

[0096] The main controller 121 which has received the aforesaid dummyend signal immediately verifies whether or not the main carrier unit 111is keeping another wafer W. When the main carrier unit 111 is notkeeping another wafer W, the main controller 121 instructs the maincarrier unit 111 to move to the predetermined position P where it canreceive the wafer W in the PEB unit 133, that is, a position in front ofthe shutter 133 b of the PEB unit 133. The main carrier unit 111 whichhas received the instruction moves on the carrier rail 110 to thepredetermined position P as shown in FIG. 12 and waits there until theshutter 133 b at the carrier opening 133 a is opened.

[0097] Meanwhile, when the main carrier unit 111 is keeping anotherwafer W, the main controller 121 stores therein the dummy end signal andalways verifies whether or not the main carrier unit 111 is keeping theother wafer W, and gives a moving instruction to the main carrier unit111 to move to the predetermined position P when the main carrier unit111 completes the carrying operation of the other wafer W and becomes aso-called free state.

[0098] Thereafter, when the heat treatment in the PEB unit 133 iscompleted and the shutter 133 b is opened, the waiting main carrier unit111 immediately carries the wafer W out of the PEB unit 133 to thecooling unit 131.

[0099] The wafer W which has been carried to the cooling unit 131 iscooled to a predetermined temperature, whereby the catalysis of the acidthen stops.

[0100] Thereafter, the wafer W is carried by the main carrier unit 111to the developing treatment unit 119 or 120 to be subjected todeveloping treatment. The wafer W for which the developing treatment hasbeen completed is carried again by the main carrier unit 111 in sequenceto post-baking unit 128 or 129 and the cooling unit 127. The wafer W forwhich the cooling treatment has been completed is carried backward inthe Y-direction on the carrier rail 110 and delivered to the wafercarrier 108 in the cassette station 102. The wafer W is returned to thecassette C by the wafer carrier 108, and a series of photolithographyprocessing steps is thus completed.

[0101] In the above-described second embodiment, the PEB unit 133previously sends the dummy end signal to the main controller 121, andthe main carrier unit 111 moves by the instruction from the maincontroller 121, which has received the dummy end signal, to thepredetermined position P in front of the PEB unit 133 and waits thereuntil the PEB treatment is completed, so that the main carrier unit 111can receive the wafer W immediately after the PEB treatment for thewafer W is completed and the shutter 133 is opened, and carry it to thecooling unit 131. This avoids the wafer W, for which the PEB treatmenthas completed, from being waiting in the PEB unit 133 for the maincarrier unit 111 to come to receive it, whereby the period required fromthe PEB treatment to the cooling treatment is reduced and kept fixed.

[0102] Further, before the main controller 121 which has received thedummy end signal gives a moving instruction to the main carrier unit111, the main controller 121 verifies whether or not the main carrierunit 111 is carrying another wafer W, and when it is carrying, the maincontroller 121 gives the moving instruction immediately after thecompletion of the carrying, thereby making it possible to properly copewith the case where the main carrier unit 111 can not move to thepredetermined position P because of the carrying of the other wafer WFurthermore, as compared with the conventional case in which after thePEB treatment for the wafer W is completed, the end signal is sent tothe main controller 121, and thereafter the main carrier unit 111verifies the end signal and then moves to the predetermined position P,the main carrier unit 111 can move earlier to the predetermined positionP where it can receive the wafer W, and thus the period required fromthe PEB treatment to the cooling treatment is reduced and kept fixedalso in this case.

[0103] The above-described embodiment is the case in which the maincarrier unit 111 has moved to the predetermine position P where it canaccess the PEB unit 133 without fail before the completion of the PEBtreatment. However, it is predictable that it takes a long time for themain carrier unit 111 to carry another wafer W to be late for the timeat the completion of the PEB treatment. As measures in this case, it issuggested that the overbaked wafer W is separated from the properlyprocessed wafers W.

[0104] For example, imaginary numbers are previously given asdiscrimination marks to the wafers W, and previously recognized by, forexample, the main controller 121. When the main carrier unit 111 is latefor the time at the completion of the PEB treatment, the main controller121 recognizes the number of the wafer under processing at that time asa wafer needing caution. Thereafter, the wafer needing caution isprocessed in accordance with the predetermined processing flow, and whenit is carried to the cassette C in the cassette station 102, it isseparated and mounted, for example, in a cassette C1 which is previouslyprovided for a wafer needing caution as shown in FIG. 13. This makes itpossible to separate the overbaked wafer W and the normallyPEB-processed wafers W, thereby removing a wafer W of a poor qualityfrom products.

[0105] Alternatively, the wafer W overbaked in the PEB unit 133 may becarried, not subjected to the following processing, immediately to thecassette station 102 to be carried into the cassette C1 for the wafer Wneeding caution. In this case, the developing treatment and the like arenot performed yet, making it possible to use again the wafer W byremoving the resist film thereon.

[0106] Note that the predetermined period T of the controller 133 c ispreferably set to be somewhat long enough to prevent the main carrierunit 111 from not usually being late for the completion of the PEBtreatment.

[0107] The method of carrying the wafer W according to theabove-described embodiment is for the carrying from the PEB unit 133 tothe cooling unit 131, and it is also applicable to the carrying betweenanother heat treatment unit and cooling treatment unit, for example,between the pre-baking unit 124 or 125 and the cooling unit 126, andbetween the post-baking unit 128 or 129 and the cooling unit 127.

[0108] Furthermore, the above-described embodiment is for the method ofcarrying the wafer W in the photolithography process in thesemiconductor wafer device fabrication processes, and the presentinvention is applicable to a method of carrying a substrate other thanthe semiconductor wafer, for example, an LCD substrate.

[0109] According to the present invention, the carrier unit for thesubstrate keeps waiting from before the completion of the heat treatmentfor the substrate at the position where it can receive the substrate inthe heat treatment unit in which the heat treatment is performing, toimmediately carry the substrate, for which the heat treatment has beencompleted, to the cooling treatment unit, whereby the period requiredfrom the heat treatment to the cooling treatment is reduced and keptfixed. Consequently, overbaking or difference in thermal history betweensubstrates is reduced to form a predetermined pattern on the substrate,resulting in improved yields.

What is claimed is:
 1. A method of performing processing for asubstrate, comprising the step of: carrying the substrate, which hasbeen pre-treated, to a heat treatment unit for heating the substrate,prior to supplying a treatment solution to the substrate to performsolution treatment, wherein the carrying is performed such as to fix aperiod after the pretreatment for the substrate is completed and beforethe substrate is carried to the heat treatment unit.
 2. A method ofperforming processing for a substrate, comprising the step of: carryingthe substrate, which has been exposure-processed, to a heat treatmentunit where heat treatment before developing treatment is performed,wherein the carrying is performed such as to fix a period after theexposure processing for the substrate is completed and before thesubstrate is carried to the heat treatment unit.
 3. A method ofperforming processing for a substrate, comprising the steps of: carryingthe substrate, which has been exposure-processed, temporarily to adelivery unit by a first carrier; and thereafter carrying the substratestaying in the delivery unit to a heat treatment unit where heattreatment before developing treatment is performed, by a second carrier,wherein at least when the exposure for the substrate is completed, thefirst carrier is waiting at a first position where the first carrier iscapable of receiving the exposed substrate to immediately carry thesubstrate, for which the exposure has been completed, to the deliveryunit, and wherein at least when the exposed substrate is carried to thedelivery unit, the second carrier is waiting at a second position wherethe second carrier is capable of receiving the substrate staying in thedelivery unit to carry the substrate to the heat treatment unitimmediately after the exposed substrate is carried to the delivery unit.4. The method as set forth in claim 3, wherein when a predeterminedperiod T is required for the exposure processing for the substrate, evenif the predetermined period T elapses before the completion of theexposure processing, the first carrier is waiting at the first positionuntil after a lapse of a period not longer than a maximum waiting periodI which is longer than the predetermined period T, measured from thestart of the exposure processing.
 5. The method as set forth in claim 3,wherein when a predetermined period T is required for the exposureprocessing for the substrate, even if the predetermined period T elapsesbefore the completion of the exposure processing, the second carrier iswaiting at the second position until after a lapse of a period notlonger than a maximum waiting period M which is longer than thepredetermined period T, measured from the start of the exposureprocessing.
 6. A method of performing processing for a substrate,comprising the steps of: carrying the substrate, which has beenexposure-processed, temporarily to a delivery unit by a first carrier;and thereafter carrying the substrate staying in the delivery unit to aheat treatment unit where heat treatment before developing treatment isperformed, by a second carrier, wherein at least when the exposureprocessing for the substrate is completed, the first carrier is waitingat a predetermined position where the first carrier is capable ofreceiving the substrate to carry the substrate to the delivery unitimmediately after the exposure processing for the substrate iscompleted.
 7. The method as set forth in claim 6, wherein when apredetermined period T is required for the exposure processing for thesubstrate, even if the predetermined period T elapses before thecompletion of the exposure processing, the first carrier is waiting atthe predetermined position until after a lapse of a period not longerthan a maximum waiting period I which is longer than the predeterminedperiod T, measured from the start of the exposure processing.
 8. Amethod of performing processing for a substrate, comprising the stepsof: carrying the substrate, which has been exposure-processed,temporarily to a delivery unit by a first carrier; and thereaftercarrying the substrate staying in the delivery unit to a heat treatmentunit where heat treatment before developing treatment is performed, by asecond carrier, wherein at least when the substrate is carried to thedelivery unit, the second carrier is waiting at a predetermined positionwhere the second carrier is capable of receiving the substrate to carrythe substrate to the heat treatment unit immediately after the substrateis carried to the delivery unit.
 9. The method as set forth in claim 8,wherein when a predetermined period T is required for the exposureprocessing for the substrate, even if the predetermined period T elapsesbefore the completion of the exposure processing, the second carrier iswaiting at the predetermined position until after a lapse of a periodnot longer than a maximum waiting period M which is longer than thepredetermined period T, measured from the start of the exposureprocessing.
 10. A substrate processing apparatus for performingprocessing for a substrate, comprising: a carrier for carrying thesubstrate, which has been pre-treated, to a heat treatment unit forheating the substrate prior to solution treatment performed by supplyinga treatment solution to the substrate; and a controller for controllingthe carrier such as to fix a period after the pretreatment for thesubstrate is completed and before the substrate is carried to the heattreatment unit.
 11. A substrate processing apparatus for performingprocessing for a substrate, comprising: a carrier for carrying thesubstrate, which has been exposure-processed, to a heat treatment unitwhere heat treatment before developing treatment is performed; and acontroller for controlling the carrier such as to fix a period after theexposure processing for the substrate is completed and before thesubstrate is carried to the heat treatment unit.
 12. A substrateprocessing apparatus for performing processing for a substrate,comprising: a first carrier for carrying the substrate, which has beenexposure-processed, to a delivery unit; a second carrier for carryingthe substrate staying in the delivery unit to a heat treatment unitwhere heat treatment before developing treatment is performed; and acontroller for controlling the first carrier and the second carrier,wherein the controller conducts a control so that at least when theexposure processing for the substrate is completed, the first carrier iswaiting at a first position where the first carrier is capable ofreceiving the exposed substrate to immediately carry the substrate, forwhich the exposure processing has been completed, to the delivery unit,and further at least when the exposure-processed substrate is carried tothe delivery unit, the second carrier is waiting at a second positionwhere the second carrier is capable of receiving the substrate stayingin the delivery unit to carry the substrate to the heat treatment unitimmediately after the exposure-processed substrate is carried to thedelivery unit.
 13. A substrate processing apparatus for performingprocessing for a substrate, comprising: a first carrier for carrying thesubstrate, which has been exposure-processed, to a delivery unit; asecond carrier for carrying the substrate staying in the delivery unitto a heat treatment unit where heat treatment before developingtreatment is performed; and a controller for controlling the firstcarrier and the second carrier, wherein the controller conducts acontrol so that at least when the exposure processing for the substrateis completed, the first carrier is waiting at a predetermined positionwhere the first carrier is capable of receiving the substrate to carrythe substrate to the delivery unit immediately after the exposureprocessing for the substrate is completed.
 14. A substrate processingapparatus for performing processing for a substrate, comprising: a firstcarrier for carrying the substrate, which has been exposure-processed,to a delivery unit; a second carrier for carrying the substrate stayingin the delivery unit to a heat treatment unit where heat treatmentbefore developing treatment is performed; and a controller forcontrolling the first carrier and the second carrier, wherein thecontroller conducts a control so that at least when the substrate iscarried to the delivery unit, the second carrier is waiting at apredetermined position where the second carrier is capable of receivingthe substrate to carry the substrate to the heat treatment unitimmediately after the substrate is carried to the delivery unit.
 15. Asubstrate carrying method of carrying a substrate, which has beenheat-treated in a heat treatment unit, by a carrier to a coolingtreatment unit where cooling treatment for the substrate is performed,wherein at least when the heat treatment for the substrate is completed,the carrier is waiting at a predetermined position where the carrier iscapable of receiving the substrate in the heat treatment unit.
 16. Thecarrying method as set forth in claim 15, wherein operation of thecarrier unit is controlled by a carrier controller, and wherein an endnotice signal is sent from the heat treatment unit to the carriercontroller a predetermined period before the completion of the heattreatment, said method further comprising the step of: the carriercontroller moving the carrier to the predetermined position based on theend notice signal.
 17. The carrying method as set forth in claim 15,wherein the substrate, for which the heat treat treatment has beencompleted, is immediately carried to the cooling treatment unit.
 18. Asubstrate carrying method of carrying a substrate, which has beenheat-treated in a heat treatment unit, by a carrier to a coolingtreatment unit where cooling treatment for the substrate is performed,wherein operation of the carrier unit is controlled by a carriercontroller, and wherein an end notice signal is sent from the heattreatment unit to the carrier controller a predetermined period beforethe completion of the heat treatment, said method comprising the stepsof: the carrier controller receiving the end notice signal; and thecarrier controller which has received the end notice signal verifyingwhether or not the carrier is carrying another substrate, wherein whenthe carrier is not carrying the other substrate, the carrier controllermoves the carrier to a predetermined position where the carrier iscapable of receiving the substrate in the heat treatment unit, and keepsthe carrier waiting, and wherein when the carrier is carrying the othersubstrate, the carrier controller moves the carrier, after the carriercompletes carrying the other substrate, to the predetermined positionwhere the carrier is capable of receiving the substrate in the heattreatment unit and keeps the carrier waiting.
 19. The carrying method asset forth in claim 18, further comprising the step of: immediatelycarrying the substrate, for which the heat treatment has been completed,to the cooling treatment unit.
 20. The carrying method as set forth inclaim 18, further comprising the steps of: previously giving adiscrimination mark to each substrate; and when the carrier is incapableof waiting at the predetermined position at the completion of the heattreatment for the substrate, recognizing the substrate related to thecompleted heat treatment as a substrate needing caution based of thediscrimination mark.
 21. The carrying method as set forth in claim 20,further comprising the step of: separating the substrate needing cautionfrom other heat-treated substrates.
 22. The carrying method as set forthin claim 15, wherein the heat treatment is heat treatment after exposureprocessing and before developing treatment in a coating and developingtreatment process for the substrate.